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| MM3Z3V3ST1 SERIES Zener Voltage Regulators 200 mW SOD-323 Surface Mount Tight Tolerance Portfolio This series of Zener diodes is packaged in a SOD-323 surface mount package that has a power dissipation of 200 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand-held portables, and high density PC boards. Specification Features: http://onsemi.com 1 Cathode 2 Anode * Standard Zener Breakdown Voltage Range - * * * * * * * 2 1 SOD-323 CASE 477 STYLE 1 MARKING DIAGRAM XXMG G 3.3 V to 36 V Steady State Power Rating of 200 mW Small Body Outline Dimensions: 0.067 x 0.049 (1.7 mm x 1.25 mm) Low Body Height: 0.035 (0.9 mm) Package Weight: 4.507 mg/unit ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ Pb-Free Packages are Available XX = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. Mechanical Characteristics: CASE: Void-free, transfer-molded plastic FINISH: All external surfaces are corrosion resistant MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: ORDERING INFORMATION Device MM3ZxxxST1 MM3ZxxxST1G MM3ZxxxST3 MM3ZxxxST3G Package SOD-323 SOD-323 (Pb-Free) SOD-323 SOD-323 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel 10,000/Tape & Reel 10,000/Tape & Reel 260C for 10 Seconds LEADS: Plated with Pb-Sn or Sn only (Pb-Free) POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V-0 MOUNTING POSITION: Any MAXIMUM RATINGS Rating Total Device Dissipation FR-5 Board, (Note 1) @ TA = 25C Derate above 25C Thermal Resistance from Junction-to-Ambient Junction and Storage Temperature Range Symbol PD Max 200 1.5 635 -65 to +150 Unit mW mW/C C/W C For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. RqJA TJ, Tstg Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-4 Minimum Pad. (c) Semiconductor Components Industries, LLC, 2009 October, 2009 - Rev. 16 1 Publication Order Number: MM3Z2V4ST1/D MM3Z3V3ST1 SERIES ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol VZ IZT ZZT IZK ZZK IR VR IF VF QVZ C Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz VZ VR IR VF IZT V IF I Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ Min 2.90 3.32 3.89 4.17 4.55 4.98 5.49 6.06 6.65 7.28 8.02 8.85 9.80 11.74 14.34 15.85 17.56 21.54 23.72 26.19 32.15 35.07 Max 3.11 3.53 4.16 4.43 4.75 5.2 5.73 6.33 6.93 7.6 8.36 9.23 10.20 12.24 14.98 16.51 18.35 22.47 24.78 27.53 33.79 36.87 ZZK IZ = 0.5 mA W Max 1000 1000 1000 1000 800 500 200 100 160 160 160 160 160 80 80 80 80 100 120 300 300 500 ZZT IZ = IZT @ 10% Mod W Max 100 95 90 90 80 60 40 10 15 15 15 15 15 25 40 40 45 55 70 80 80 90 Max IR @ VR mA 10 5.0 3.0 3.0 3.0 2.0 1.0 3.0 2.0 1.0 0.7 0.5 0.5 0.1 0.1 0.05 0.05 0.05 0.05 0.05 0.05 0.05 V 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 6.0 8.0 11 11.2 12.6 15.4 16.8 18.9 23.2 25.2 dVZ/dt (mV/k) @ IZT1 = 5 mA Min -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 6.0 8.8 10.4 12.4 16.4 18.4 21.4 27.4 30.4 Max 0 0 -2.5 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 10 12.7 14 16 20 22 25.3 33.4 37.4 Device* MM3Z3V0ST1, G MM3Z3V3ST1, G MM3Z3V9ST1, G MM3Z4V3ST1, G MM3Z4V7ST1, G MM3Z5V1ST1, G MM3Z5V6ST1, G MM3Z6V2ST1, G MM3Z6V8ST1, G MM3Z7V5ST1, G MM3Z8V2ST1, G MM3Z9V1ST1, G MM3Z10VST1, G MM3Z12VST1, G MM3Z15VST1, G MM3Z16VST1, G MM3Z18VST1, G MM3Z22VST1G MM3Z24VST1G MM3Z27VST1G MM3Z33VST1G MM3Z36VST1G Device Marking T4 T5 T7 T8 T9 TA TC TE TF TG TH TK WB TN TP TU TW WP WT WQ WR WU Test Current Izt mA 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 C pF Max @ VR = 0 f = 1 MHz 450 450 450 450 260 225 200 185 155 140 135 130 130 130 130 105 100 85 80 70 70 70 *The "G'' suffix indicates Pb-Free package available. http://onsemi.com 2 MM3Z3V3ST1 SERIES TYPICAL CHARACTERISTICS 1000 Z ZT , DYNAMIC IMPEDANCE ( ) TJ = 25C IZ(AC) = 0.1 IZ(DC) f = 1 kHz 1000 IF, FORWARD CURRENT (mA) 100 100 IZ = 1 mA 10 5 mA 10 150C 75C 1.0 0.4 0.5 25C 0C 1.1 1.2 1.0 3.0 VZ, NOMINAL ZENER VOLTAGE 10 0.6 0.7 0.8 0.9 1.0 VF, FORWARD VOLTAGE (V) Figure 1. Effect of Zener Voltage on Zener Impedance 1000 IR, LEAKAGE CURRENT ( A) TA = 25C C, CAPACITANCE (pF) 0 V BIAS 1 V BIAS 1000 100 10 1.0 0.1 0.01 Figure 2. Typical Forward Voltage 100 BIAS AT 50% OF VZ NOM 10 +150C 0.001 + 25C -55C 0 5.0 VZ, NOMINAL ZENER VOLTAGE (V) 10 0.0001 1.0 4.0 VZ, NOMINAL ZENER VOLTAGE (V) 10 0.00001 Figure 3. Typical Capacitance Figure 4. Typical Leakage Current 100 TA = 25C I Z , ZENER CURRENT (mA) 100 80 POWER DISSIPATION (%) 0 2.0 4.0 6.0 VZ, ZENER VOLTAGE (V) 8.0 10 60 40 20 0 10 1.0 0.1 0.01 0 25 50 75 100 TEMPERATURE (C) 125 150 Figure 5. Zener Voltage versus Zener Current (VZ Up to 9 V) Figure 6. Steady State Power Derating http://onsemi.com 3 MM3Z3V3ST1 SERIES PACKAGE DIMENSIONS SOD-323 CASE 477-02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 STYLE 1: PIN 1. CATHODE 2. ANODE INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 HE D b 1 2 E MIN 0.031 0.000 A3 A C L A1 NOTE 3 NOTE 5 SOLDERING FOOTPRINT* 0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 MM3Z2V4ST1/D |
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